Japan Intellectual Property Rights: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Japan, July 27 -- MITSUBISHI ELECTRIC CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2023-085340

Category (FI): H10D62/10,101@V,H01L29/78,657@A,H01L29/78,655@D,H01L29/78,657@D,H01L29/78,653@A,H01L29/78,652@P,H01L29/78,658@A,H01L29/78,655@E,H01L29/78,655@G,H01L29/78,655@B,H01L29/06,301@G,H01L29/06,301@V,H01L29/78,652@J,H01L29/78,652@Q,H01L29/78,652@T,H01L29/91@C,H01L29/91@D,H01L29/91@E,H01L29/91@F,H01L29/78,657@F,H01L29/90@D,H10D8/25,H10D8/50@C,H10D8/50@D,H10D8/50@E,H10D8/50@F,H10D12/00,101@R,H10D12/00,101@P,H10D12/00,101@S,H10D12/00,103@S,H10D30/66,201@A,H10D30/66,103@Q,H10D30/66,103@B,H10D30/66,101@T,H10D30/66,101@H,H10D30/01,301@A,H10D8/25@Z,H10D84/80,203@F,H10D84/80,203@D,H10D84/80,203@A,H10D62/10,101@G

Stage: Grant (IP right granted following substantive examination.)

Filing Date: May 24, 2023

Publication Date: Dec. 5, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.