Japan, Oct. 30 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LASER PROCESSING APPARATUS.' Other related details are as follows:
Application Number: JP,2024-226382
Category (FI): H01L21/78@L,B23K26/364,B23K26/18,H01L21/78@B
Stage: Grant (IP right document published.)
Filing Date: Dec. 23, 2024
Publication Date: March 18
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
