Japan Intellectual Property Rights: SiC WAFER AND MANUFACTURING METHOD THEREOF

Japan, Jan. 20 -- PROTERIAL LTD has got intellectual property rights for 'SiC WAFER AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:

Application Number: JP,2023-093212

Category (FI): C30B29/36@A,H10P14/24,H10P14/20,H10D30/66,101@T,H10D30/01,301@E,H10D12/01@E,H10D12/00,101@T,H01L29/78,658@E,H01L29/78,655@A,H01L29/78,652@T,H01L21/205,H01L21/20,C30B25/20

Stage: Grant (IP right granted following substantive examination.)

Filing Date: June 6, 2023

Publication Date: Aug. 18, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.