Japan Intellectual Property Rights: SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, ONBOARD ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, ONBOARD ELECTRONIC CIRCUIT DEVICE, AND ECU ELECTRONIC CIRCUIT DEVICE

Japan, Nov. 6 -- SENJU METAL IND CO LTD has got intellectual property rights for 'SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, ONBOARD ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, ONBOARD ELECTRONIC CIRCUIT DEVICE, AND ECU ELECTRONIC CIRCUIT DEVICE.' Other related details are as follows:

Application Number: JP,2025-003029

Category (FI): C22C13/02,B23K35/26,310@A,B23K1/00,330@E,B23K35/363@E

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Jan. 8, 2025

Publication Date: April 10, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.