Japan, Nov. 6 -- SENJU METAL IND CO LTD has got intellectual property rights for 'SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM AND SOLDER JOINT.' Other related details are as follows:
Application Number: JP,2025-003030
Category (FI): B23K35/363@E,B23K35/26,310@A,C22C13/02
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 8, 2025
Publication Date: April 10, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
