Japan Intellectual Property Rights: SOLDER PRINTING POSITION MEASUREMENT METHOD, SOLDER PRINTING POSITION MEASUREMENT DEVICE, AND PRINTED CIRCUIT BOARD PRODUCT

Japan, Jan. 23 -- MITSUBISHI ELECTRIC CORP has got intellectual property rights for 'SOLDER PRINTING POSITION MEASUREMENT METHOD, SOLDER PRINTING POSITION MEASUREMENT DEVICE, AND PRINTED CIRCUIT BOARD PRODUCT.' Other related details are as follows:

Application Number: JP,2022-024076

Category (FI): H05K3/34,512@A,H05K3/3485@C,H05K3/34,505@D,H05K3/341

Stage: Grant (IP right document published.)

Filing Date: Feb. 18, 2022

Publication Date: Aug. 30, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.