Japan Intellectual Property Rights: SUBSTRATE POLISHING METHOD, PROGRAM, AND SUBSTRATE POLISHING DEVICE

Japan, Sept. 9 -- EBARA CORP has got intellectual property rights for 'SUBSTRATE POLISHING METHOD, PROGRAM, AND SUBSTRATE POLISHING DEVICE.' Other related details are as follows:

Application Number: JP,2022-081873

Category (FI): B24B37/30@E,B24B37/005@A,B24B37/013,B24B41/06@A,B24B49/12,B24B47/22,H01L21/304,622@K,H10P52/00@N,H10P52/40

Stage: Grant (IP right granted following substantive examination.)

Filing Date: May 18, 2022

Publication Date: Dec. 1, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.