Japan, Jan. 15 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'THERMALLY CONDUCTIVE COMPOSITION.' Other related details are as follows:
Application Number: JP,2022-056755
Category (FI): C08K3/013,C08L83/04,C08L83/06,C09K5/12@E,H01L23/36@M,H10W40/25
Stage: Grant (IP right document published.)
Filing Date: March 30, 2022
Publication Date: Oct. 13, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
