Japan, June 10 -- JSP CORP has got intellectual property rights for 'THERMOPLASTIC RESIN FOAM PARTICLE, AND THERMOPLASTIC RESIN FOAM PARTICLE MOLDING.' Other related details are as follows:
Application Number: JP,2022-112865
Category (FI): C08J9/16
Stage: Grant (IP right document published.)
Filing Date: July 14, 2022
Publication Date: Jan. 25, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
