Japan, Jan. 23 -- TLV CO LTD has got intellectual property rights for 'THICKNESS MEASURING DEVICE AND METHOD FOR MEASURING THICKNESS.' Other related details are as follows:
Application Number: JP,2021-209668
Category (FI): G01R33/02@B
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 23, 2021
Publication Date: July 5, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
