Japan, April 9 -- CHIPBOND TECHNOLOGY CORP has got intellectual property rights for 'THIN FILM CIRCUIT BOARD.' Other related details are as follows:
Application Number: JP,2023-213743
Category (FI): H05K7/20@F,H01L23/36@C,H10W40/20@C
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 19, 2023
Publication Date: Nov. 28, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
