Japan Intellectual Property Rights: THIN SUBSTRATE BONDING AND PEELING METHOD, THIN SUBSTRATE MANUFACTURING METHOD, THIN SUBSTRATE, PEELING DEVICE, AND BONDING DEVICE

Japan, Jan. 16 -- RAN TECHNICAL SERVICE KK has got intellectual property rights for 'THIN SUBSTRATE BONDING AND PEELING METHOD, THIN SUBSTRATE MANUFACTURING METHOD, THIN SUBSTRATE, PEELING DEVICE, AND BONDING DEVICE.' Other related details are as follows:

Application Number: JP,2021-167417

Category (FI): H01L21/02@B,H01L21/02@C

Stage: Grant (IP right document published.)

Filing Date: Oct. 12, 2021

Publication Date: April 24, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.