Japan, Nov. 11 -- SEIKO EPSON CORP has got intellectual property rights for 'THREE-DIMENSIONAL MOLDING APPARATUS.' Other related details are as follows:
Application Number: JP,2022-008462
Category (FI): B29C64/209,B29C64/245,B29C64/295,B29C64/393,B33Y30/00,B33Y50/02,B22F10/10,B22F12/53,B28B1/30,B29C64/118
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 24, 2022
Publication Date: Aug. 3, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
