Japan, July 27 -- TAIWAN-ASIA SEMICONDUCTOR CORP has got intellectual property rights for 'WAFER EXPOSURE LAYOUT METHOD.' Other related details are as follows:
Application Number: JP,2025-006163
Category (FI): G03F7/20,501,G03F7/20,521
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 16, 2025
Publication Date: Nov. 19, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
