Japan Intellectual Property Rights: WAFER FILM THICKNESS MEASURING APPARATUS, MEASURING METHOD, WAFER POLISHING DEVICE, AND POLISHING METHOD

Japan, Nov. 4 -- WUHAN EOPTICS TECHNOLOGY CO LTD,SHANGHAI PRECISION MEASUREMENT SEMICONDUCTOR TECHNOLOGY INC has got intellectual property rights for 'WAFER FILM THICKNESS MEASURING APPARATUS, MEASURING METHOD, WAFER POLISHING DEVICE, AND POLISHING METHOD.' Other related details are as follows:

Application Number: JP,2025-120357

Category (FI): H01L21/304,622@S,H10P52/40,H10P52/00@V,G01B11/06@Z,B24B49/12,B24B49/04@Z,B24B37/10,B24B37/013,H01L21/304,621@D,H10P52/00@E

Stage: Grant (IP right granted following substantive examination.)

Filing Date: July 17, 2025

Publication Date: Jan. 29

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.