Japan, Nov. 11 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER REGENERATION PROCESS.' Other related details are as follows:
Application Number: JP,2022-041319
Category (FI): H01L21/304,622@S,B23Q17/20@A,B24B49/12,B24B49/04@Z,B24B7/04@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 16, 2022
Publication Date: Sept. 29, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
