Japan, Jan. 20 -- FERROTEC MATERIAL TECHNOLOGIES CORP has got intellectual property rights for 'WAFER SUPPORT.' Other related details are as follows:
Application Number: JP,2023-015682
Category (FI): C04B35/5835,H10P72/72,H01L21/68@R,C04B41/87@F
Stage: Grant (IP right document published.)
Filing Date: Feb. 3, 2023
Publication Date: Aug. 16, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
