Japan, March 27 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER TRANSFER METHOD, AND WAFER TRANSFER DEVICE.' Other related details are as follows:
Application Number: JP,2022-023417
Category (FI): H01L21/68@N,H10P58/00@M,H10P72/70
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Feb. 18, 2022
Publication Date: Aug. 30, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
