Japan, Oct. 5 -- DISCO CORP has got intellectual property rights for 'WAFER TRANSFER METHOD AND WAFER TRANSFER DEVICE.' Other related details are as follows:
Application Number: JP,2023-018877
Category (FI): H01L21/68@N,H10P72/70
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Feb. 10, 2023
Publication Date: Aug. 23, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
