Japan, April 17 -- SHINKAWA LTD has got intellectual property rights for 'WIRE BONDING METHOD AND WIRE BONDING DEVICE.' Other related details are as follows:
Application Number: JP,2023-008212
Category (FI): H10W72/50@G,H01L21/60,301@G
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 23, 2023
Publication Date: Aug. 2, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
