Japan, Oct. 5 -- NITTO DENKO CORP has got intellectual property rights for 'WIRING CIRCUIT BOARD, ELECTRICAL ELEMENT MOUNTING SUBSTRATE, WIRING CIRCUIT BOARD MANUFACTURING METHOD, AND ELECTRICAL ELEMENT MOUNTING SUBSTRATE MANUFACTURING METHOD.' Other related details are as follows:
Application Number: JP,2022-211280
Category (FI): H10W70/685,H01L23/12@L,H01L23/12@J,H05K3/46@H,H05K3/46@U,H10W70/00@J,H10W70/00@L,H10W70/06,H10W70/63,H05K3/46@B
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 28, 2022
Publication Date: July 10, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
