Japan, Jan. 21 -- ハイペット株式会社 holds the trademark for 'Ｂｏｎｄｓ.' Other related details are as follows:
Application Number: Reg.No.7004596
Class: 03,05,20,21,28,31
Status: LIVE-REGISTRATION-Published for Opposition
Filing Date: June 4, 2024
Registration Date: Jan. 9
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/c1801/TR/JP-2024-059496/40/en
Disclaimer: Curated by HT Syndication.
