Japan, Jan. 16 -- SOKEN INC,DENSO CORP has got intellectual property rights for 'ELECTRONIC KEY SYSTEM AND LOCK CONTROL DEVICE.' Other related details are as follows: Application Number: JP,2022-092459 Category (FI): B60R25/24,E05B49/00@K,E05B81/76,G01S13/78,G01S13/87 Stage: Grant (IP right granted following substantive examination.) Filing Date: June 7, 2022 Publication Date: Dec. 19, 2023 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated...
Japan, Jan. 16 -- MITSUI HIGH TEC INC has got intellectual property rights for 'STYLUS OF CONTACT TYPE PROBE.' Other related details are as follows: Application Number: JP,2022-092094 Category (FI): G01B5/016 Stage: Grant (IP right granted following substantive examination.) Filing Date: June 7, 2022 Publication Date: Dec. 19, 2023 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, Jan. 16 -- MITSUBA CORP has got intellectual property rights for 'MAGNET ROTOR AND POWER GENERATOR.' Other related details are as follows: Application Number: JP,2022-091425 Category (FI): H02K7/10@C Stage: Grant (IP right document published.) Filing Date: June 6, 2022 Publication Date: Dec. 18, 2023 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, Jan. 16 -- SHIN ETSU HANDOTAI CO LTD has got intellectual property rights for 'METHOD FOR DRY ETCHING SINGLE CRYSTAL SILICON WAFER, METHOD FOR PRODUCING SINGLE CRYSTAL SILICON WAFER, AND SINGLE CRYSTAL SILICON WAFER.' Other related details are as follows: Application Number: JP,2022-090955 Category (FI): H01L21/302,105@B,H01L21/304,601@Z,H10P50/20,105@B,H10P50/28,H10P95/60@Z Stage: Grant (IP right granted following substantive examination.) Filing Date: June 3, 2022 Publication Date:...
Japan, Jan. 16 -- FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD has got intellectual property rights for 'ELECTROMAGNETIC CONTACTOR.' Other related details are as follows: Application Number: JP,2022-090930 Category (FI): H01H45/02@E,H01H45/02@F,H01H50/02@C,H01H9/04@A,H01H9/04@G Stage: Grant (IP right granted following substantive examination.) Filing Date: June 3, 2022 Publication Date: Dec. 14, 2023 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaime...
Japan, Jan. 16 -- COMPUTER ENGINEERING & CONSULTING LTD has got intellectual property rights for 'USER AUTHENTICATION SYSTEM, USER AUTHENTICATION SERVICE SYSTEM, USER AUTHENTICATION METHOD, AND COMPUTER PROGRAM.' Other related details are as follows: Application Number: JP,2022-090816 Category (FI): G06Q50/26,300 Stage: Grant (IP right granted following substantive examination.) Filing Date: June 3, 2022 Publication Date: Dec. 14, 2023 The original document can be viewed at: https://www.j-...
Japan, Jan. 16 -- TAISEI CORP has got intellectual property rights for 'DESIGN METHOD ACCORDING TO SEQUENTIAL EXCAVATION ANALYSIS OF MOUNTAIN TUNNEL.' Other related details are as follows: Application Number: JP,2022-090414 Category (FI): E02F9/22@K,G01N3/00@M,G01N33/38 Stage: Grant (IP right granted following substantive examination.) Filing Date: June 2, 2022 Publication Date: Dec. 14, 2023 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curat...
Japan, Jan. 16 -- APIC YAMADA CORP has got intellectual property rights for 'COMPRESSION MOLDING DEVICE AND COMPRESSION MOLDING METHOD.' Other related details are as follows: Application Number: JP,2022-090236 Category (FI): B29C43/18,B29C43/34 Stage: Grant (IP right document published.) Filing Date: June 2, 2022 Publication Date: Dec. 14, 2023 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, Jan. 16 -- APIC YAMADA CORP has got intellectual property rights for 'COMPRESSION MOLDING DEVICE AND COMPRESSION MOLDING METHOD.' Other related details are as follows: Application Number: JP,2022-090231 Category (FI): B29C43/18,B29C43/34 Stage: Grant (IP right document published.) Filing Date: June 2, 2022 Publication Date: Dec. 14, 2023 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, Jan. 16 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'GRINDING METHOD FOR WORK-PIECE.' Other related details are as follows: Application Number: JP,2022-090120 Category (FI): B24B1/00@F,B24B7/04@A,H01L21/304,631,H10P52/00@C Stage: Grant (IP right granted following substantive examination.) Filing Date: June 2, 2022 Publication Date: Dec. 14, 2023 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndicat...