Japan, Sept. 14 -- KAO CORP has got intellectual property rights for 'ASPHALT MIXTURE.' Other related details are as follows: Application Number: JP,2022-190440 Category (FI): C08K3/013,C08K3/04,C08L95/00,E01C7/26 Stage: Grant (IP right granted following substantive examination.) Filing Date: Nov. 29, 2022 Publication Date: June 10, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, Sept. 14 -- OMRON CORP has got intellectual property rights for 'POWER BREAKER, POWER INTERRUPTION SYSTEM WITH THE SAME, PROTECTION METHOD FOR POWER BREAKER, AND PROTECTION PROGRAM.' Other related details are as follows: Application Number: JP,2022-189855 Category (FI): H02H5/04,140 Stage: Grant (IP right granted following substantive examination.) Filing Date: Nov. 29, 2022 Publication Date: June 10, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p01...
Japan, Sept. 14 -- IXIS INC has got intellectual property rights for 'SUPPLY SYSTEM AND SUPPLY METHOD.' Other related details are as follows: Application Number: JP,2022-189779 Category (FI): G06Q50/06,E03B3/08@Z,H02S40/10 Stage: Grant (IP right granted following substantive examination.) Filing Date: Nov. 29, 2022 Publication Date: June 10, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, Sept. 14 -- NITTO DENKO CORP has got intellectual property rights for 'LIQUID SURFACE PROTECTION MATERIAL FOR SEMICONDUCTOR WAFER PROCESSING, PROTECTION FILM MADE OF LIQUID SURFACE PROTECTION MATERIAL FOR SEMICONDUCTOR WAFER PROCESSING, AND PROCESSING METHOD FOR SEMICONDUCTOR WAFER.' Other related details are as follows: Application Number: JP,2022-189164 Category (FI): H01L21/304,631,H10P52/00@M,H10P52/00@C,C09D5/02,C09D133/06,H01L21/304,622@J Stage: Grant (IP right granted following ...
Japan, Sept. 14 -- JFE METAL PRODUCTS & ENGINEERING INC has got intellectual property rights for 'CORRUGATED BOARD CONNECTING FITTING.' Other related details are as follows: Application Number: JP,2022-189137 Category (FI): F16B5/02@U,F16B43/00@Z,F16B35/04@K Stage: Grant (IP right granted following substantive examination.) Filing Date: Nov. 28, 2022 Publication Date: June 7, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syn...
Japan, Sept. 14 -- NITTO SEIKO CO LTD has got intellectual property rights for 'PART SUPPLY DEVICE.' Other related details are as follows: Application Number: JP,2022-188462 Category (FI): B08B5/02@Z,B08B5/00@A,B08B3/02@C,B65G47/14@B Stage: Grant (IP right granted following substantive examination.) Filing Date: Nov. 25, 2022 Publication Date: June 6, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, Sept. 14 -- MAKITA CORP has got intellectual property rights for 'POWER TOOL.' Other related details are as follows: Application Number: JP,2022-187784 Category (FI): B24B55/10,B25F5/02,B25F5/00@G,B24B23/02 Stage: Grant (IP right granted following substantive examination.) Filing Date: Nov. 24, 2022 Publication Date: June 5, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, Sept. 14 -- MAKITA CORP has got intellectual property rights for 'ELECTRIC TOOL.' Other related details are as follows: Application Number: JP,2022-187783 Category (FI): B24B23/02,B25F5/02,B25F5/00@G,B24B55/10 Stage: Grant (IP right granted following substantive examination.) Filing Date: Nov. 24, 2022 Publication Date: June 5, 2024 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....
Japan, Sept. 14 -- TOYOTA MOTOR CORP,SUMITOMO ELECTRIC IND LTD has got intellectual property rights for 'COIL FORMING DEVICE AND COIL FORMING METHOD.' Other related details are as follows: Application Number: JP,2022-187758 Category (FI): B32B15/08,101@Z,H01F5/06@Q,H01F41/04@F,F16C13/00@A,F16C13/00@E,F16C33/20@A,H01F5/06@H,B32B15/08@D Stage: Grant (IP right granted following substantive examination.) Filing Date: Nov. 24, 2022 Publication Date: June 5, 2024 The original document can be vie...
Japan, Sept. 14 -- TOKYO ELECTRON LTD has got intellectual property rights for 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD.' Other related details are as follows: Application Number: JP,2022-185472 Category (FI): H10P70/00,102@A,H01L21/306@A,H01L21/304,648@A,H01L21/304,648@F,H01L21/304,648@G,H10P70/00,201@L,H01L21/304,647@A,H01L21/304,647@Z,H01L21/304,651@L,H10P50/60@A,H10P50/60@J,H01L21/304,642@A,H10P70/00,107@A,H10P70/00,107@Z,H10P70/00,108@A,H10P70/00,108@F,H10P70/00,108...