Japan Intellectual Property Rights: HOLLOW FRP MOLDED PRODUCT AND ITS MANUFACTURING METHOD

Japan, Feb. 18 -- SUMITOMO RUBBER IND LTD has got intellectual property rights for 'HOLLOW FRP MOLDED PRODUCT AND ITS MANUFACTURING METHOD.' Other related details are as follows: Application Number: JP,2021-100411 Category (FI): B29L23:00,B29L31:52,B29K105:08,B29K101:10,B29C70/44,B29C70/16,B29C43/12 Stage: Grant (IP right granted following substantive examination.) Filing Date: June 16, 2021 Publication Date: Dec. 28, 2022 The original document can be viewed at: https://www.j-platpat.inpit...


Japan Intellectual Property Rights: MANUFACTURING METHOD OF DEVICE

Japan, Feb. 18 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'MANUFACTURING METHOD OF DEVICE.' Other related details are as follows: Application Number: JP,2021-099660 Category (FI): B23K26/18,B23K26/57,H01L21/02@B,H01L21/78@M,H01L21/78@P,H10P10/00@B,H10P58/00@M,H10P58/00@P Stage: Grant (IP right granted following substantive examination.) Filing Date: June 15, 2021 Publication Date: Dec. 27, 2022 The original document can be viewed at: https://www.j-platpat.inpit.go....


Japan Intellectual Property Rights: POWER SEMICONDUCTOR MODULE

Japan, Feb. 18 -- HITACHI ENERGY SWITZERLAND AG has got intellectual property rights for 'POWER SEMICONDUCTOR MODULE.' Other related details are as follows: Application Number: JP,2022-093745 Category (FI): H01L21/60,321@E,H01L25/04@C,H10W72/60@E,H10W90/00,800 Stage: Grant (IP right granted following substantive examination.) Filing Date: June 9, 2022 Publication Date: Dec. 22, 2022 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT S...


Japan Intellectual Property Rights: POWDER SEASONING FOR SOYBEAN CURD GIVING FLAVOR TO SOYBEAN CURD BY BEING MIXED WITH SOYBEAN CURD

Japan, Feb. 18 -- HOUSE FOODS CORP has got intellectual property rights for 'POWDER SEASONING FOR SOYBEAN CURD GIVING FLAVOR TO SOYBEAN CURD BY BEING MIXED WITH SOYBEAN CURD.' Other related details are as follows: Application Number: JP,2021-097832 Category (FI): A23L35/00,A23L27/00@D,A23L27/00@A Stage: Grant (IP right granted following substantive examination.) Filing Date: June 11, 2021 Publication Date: Dec. 22, 2022 The original document can be viewed at: https://www.j-platpat.inpit.go...


Japan Intellectual Property Rights: AGENT FOR CONTROLLING FORMATION OF BIOFILM OF STAPHYLOCOCCUS, AND EXTERNAL PREPARATION FOR SKIN

Japan, Feb. 18 -- PIAS ARISE KK has got intellectual property rights for 'AGENT FOR CONTROLLING FORMATION OF BIOFILM OF STAPHYLOCOCCUS, AND EXTERNAL PREPARATION FOR SKIN.' Other related details are as follows: Application Number: JP,2021-097462 Category (FI): A61K8/73,A61Q17/00,A61Q19/00 Stage: Grant (IP right granted following substantive examination.) Filing Date: June 10, 2021 Publication Date: Dec. 22, 2022 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100...


Japan Intellectual Property Rights: INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, COMPUTER PROGRAM, INFORMATION PROCESSING SYSTEM, AND PACKING MATERIAL

Japan, Feb. 18 -- GS YUASA CORP has got intellectual property rights for 'INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, COMPUTER PROGRAM, INFORMATION PROCESSING SYSTEM, AND PACKING MATERIAL.' Other related details are as follows: Application Number: JP,2021-096044 Category (FI): G06Q10/00,400,G06Q10/30,G06Q10/00,300,G06Q30/00,330,G06Q30/016,G06Q50/10,G06Q10/20 Stage: Grant (IP right granted following substantive examination.) Filing Date: June 8, 2021 Publication Date: Dec. ...


Japan Intellectual Property Rights: DETACHABLE GRINDING DISK FOR ELECTRIC GRINDER WITH HIGH ADHESION EFFICIENCY

Japan, Feb. 18 -- BIN INSUN has got intellectual property rights for 'DETACHABLE GRINDING DISK FOR ELECTRIC GRINDER WITH HIGH ADHESION EFFICIENCY.' Other related details are as follows: Application Number: JP,2021-199053 Category (FI): B24D7/16,B24B45/00@Z,B24D7/02@B Stage: Grant (IP right granted following substantive examination.) Filing Date: Dec. 8, 2021 Publication Date: Dec. 15, 2022 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated ...


Japan Intellectual Property Rights: LASER IRRADIATION DEVICE, LASER IRRADIATION METHOD AND SURFACE PROCESSED BY LASER IRRADIATION

Japan, Feb. 18 -- TOYOKOH CO LTD has got intellectual property rights for 'LASER IRRADIATION DEVICE, LASER IRRADIATION METHOD AND SURFACE PROCESSED BY LASER IRRADIATION.' Other related details are as follows: Application Number: JP,2021-093955 Category (FI): B23K26/08@Z Stage: Grant (IP right granted following substantive examination.) Filing Date: June 3, 2021 Publication Date: Dec. 15, 2022 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curat...


Japan Intellectual Property Rights: BONE FUSION DEVICE

Japan, Feb. 18 -- SMED-TA TD LLC has got intellectual property rights for 'BONE FUSION DEVICE.' Other related details are as follows: Application Number: JP,2022-089538 Category (FI): A61B17/58 Stage: Grant (IP right granted following substantive examination.) Filing Date: June 1, 2022 Publication Date: Dec. 14, 2022 The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100 Disclaimer: Curated by HT Syndication....


Japan Intellectual Property Rights: CARRIER CORE MATERIAL, ELECTROPHOTOGRAPHIC DEVELOPMENT CARRIER USING THE SAME AND ELECTROPHOTOGRAPHY DEVELOPER

Japan, Feb. 18 -- DOWA ELECTRONICS MATERIALS CO LTD,DOWA IP CREATION CO LTD has got intellectual property rights for 'CARRIER CORE MATERIAL, ELECTROPHOTOGRAPHIC DEVELOPMENT CARRIER USING THE SAME AND ELECTROPHOTOGRAPHY DEVELOPER.' Other related details are as follows: Application Number: JP,2022-068598 Category (FI): G03G9/107,321,G03G9/113,351 Stage: Grant (IP right granted following substantive examination.) Filing Date: April 19, 2022 Publication Date: Dec. 2, 2022 The original document...